5645521-1 TE Connectivity
5645521-1 - TE Connectivity
TE Connectivity
5645521-1
0-5645521-1
Other Connectors
Mini-Spring Sockets
    

Technical Characteristics

Technical Characteristics

Product Type Features

  • Sleeve Style:Closed
  • Connector System:Cable-to-Board
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board
  • Product Type:Contact
  • Profile:Zero
  • Wire/Cable Type:Discrete Wire

Body Features

  • Sealant:No
  • Sleeve Plating Material:Tin
  • Sleeve Material:Copper

Contact Features

  • Contact Base Material:Beryllium Copper
  • Contact Current Rating (Max)(A):7.5
  • Contact Type:Socket
  • Contact Spring Plating Thickness:.762µm[30µin]
  • Contact Spring Plating Material:Gold
  • Contact Mating Area Plating Thickness:30µm[30µin]
  • Contact Transmits (Typical):Signal (Data)/Power
  • Socket Type:Discrete

Termination Features

  • Termination Method to Printed Circuit Board:Through Hole - Press-Fit
  • Termination Method to Wire & Cable:Solder
  • Insertion Method:Hand/Semi-Automatic

Dimensions

  • Socket Length:3.51mm[.138in]
  • Hole Size (Recommended):1.57mm[.062in]
  • Wire/Cable Size:3.31 – 6.63mm²[12 – 9AWG]
  • Mating Pin Diameter Range:2.29 – 3.18mm[.09 – .125in]
  • PCB Thickness (Recommended):.79 – 3.18mm[.031 – .125in]

Usage Conditions

  • Operating Temperature Range:-65 – 125°C[-85 – 257°F]

Operation/Application

  • Circuit Application:Power & Signal

Packaging Features

  • Packaging Method:Reel
  • Packaging Quantity:50000

Other

  • Spring Material:Beryllium Copper

Accessories

Accessories

No details available.