5553813-4 TE Connectivity
5553813-4 - TE Connectivity
TE Connectivity
5553813-4
0-5553813-4
D-Sub and USB connectors
CHAMP Right Angle PCB Product
0
5.991

    

Technical Characteristics

Technical Characteristics

Product Type Features

  • Connector Style:Receptacle
  • Connector System:Cable-to-Board
  • Row-to-Row Spacing:.085
  • Profile:Standard
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board
  • Orientation:Reverse
  • Product Type:Connector
  • Grounded:No
  • Shielded:Yes

Configuration Features

  • Number of Positions:50
  • Number of Rows:2
  • PCB Mount Orientation:Right Angle
  • Preloaded:Yes

Body Features

  • Shield Plating Material:Nickel
  • Plating Material:Thermoplastic
  • Shield Material:Die Cast Metal
  • Color:Black
  • Bracket Material:Thermoplastic

Contact Features

  • Contact Base Material:Copper Alloy
  • PCB Contact Termination Area Plating Material:Tin
  • Contact Current Rating (Max)(A):3.5
  • Contact Mating Area Plating Thickness(µin):30
  • Contact Mating Area Plating Material:Gold

Termination Features

  • Termination Post Length(in):.157

Mechanical Attachment

  • Panel Mount Feature:With
  • PCB Mounting Style:Through Hole
  • PCB Mount Retention:With
  • PCB Mount Retention Type:Mounting Hole
  • Mating Connector Lock:With
  • Mating Connector Lock Type:Screwlocks
  • Connector Mounting Type:Board Mount
  • Mounting Hole Diameter(in):.126
  • Panel Attachment Style:Rear Mount
  • Screw Size:14702

Housing Features

  • Centerline (Pitch):2.16mm[.085in]
  • Housing Color:Black
  • Housing Material:Polyester

Dimensions

  • Panel Thickness:1.57mm[.062in]

Usage Conditions

  • Operating Temperature Range:-40 – 105°C[-40 – 221°F]

Operation/Application

  • Circuit Application:Signal

Industry Standards

  • UL Flammability Rating:UL 94V-0

Packaging Features

  • Packaging Quantity:40
  • Packaging Method:Tray

Other

  • Comb Material:Thermoplastic
  • Comment:SCSI applicable with Bail Lock Hardware Kit P/N 554818-2.

Accessories

Accessories

No details available.