5536280-1 TE Connectivity
5536280-1 - TE Connectivity
TE Connectivity
5536280-1
0-5536280-1
Other Connectors
AMP Micro-Strip Products
    

Technical Characteristics

Technical Characteristics

Product Type Features

  • PCB Connector Assembly Type:PCB Mount Header
  • Connector System:Board-to-Board
  • Row-to-Row Spacing:2.54mm[.099822in]
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board
  • Profile:Low
  • Boss:No
  • Product Type:Connector

Configuration Features

  • Stackable:Yes
  • PCB Mount Orientation:Vertical
  • Number of Positions:40
  • Board-to-Board Configuration:Vertical
  • Number of Rows:2

Electrical Characteristics

  • Insulation Resistance(MO):2

Body Features

  • Busbar Mating Area Plating Thickness:30
  • Cover Material:Phosphor Bronze
  • Busbar Termination Area Plating Material Finish:Matte
  • Busbar Termination Area Plating Material:Tin with Nickel Underplated
  • Busbar Material:Phosphor Bronze
  • Busbar Mating Area Plating Material:Gold

Contact Features

  • Contact Base Material:Phosphor Bronze
  • PCB Contact Termination Area Plating Material:Tin
  • Solder Tail Contact Plating Material Finish:Matte
  • Contact Mating Area Plating Material:Gold
  • Contact Mating Area Plating Thickness:.76µm[29.9212µin]
  • Contact Type:Pin
  • Contact Current Rating (Max)(A):10.5
  • PCB Contact Termination Area Plating Thickness:2.54 – 7.62µm[99.9998 – 299.9994µin]

Termination Features

  • Termination Method to Printed Circuit Board:Through Hole - Solder

Mechanical Attachment

  • Mating Alignment:With
  • Mating Alignment Type:Polarizing Slot
  • PCB Mount Retention:Without
  • PCB Mount Alignment:Without
  • Connector Mounting Type:Board Mount

Housing Features

  • Centerline (Pitch):1.27mm[.049in]
  • Housing Material:Matte

Dimensions

  • Stack Height:10.92mm[.43in]
  • PCB Thickness (Recommended)(in):.76
  • Height:8.64mm[.339552in]
  • Tail Length(in):.095

Usage Conditions

  • Operating Temperature Range:-65 – 125°C[-85 – 257°F]
  • Flame Retardant:Yes

Operation/Application

  • Pick and Place Cover:Without
  • Circuit Application:Signal
  • Solder Process Feature:Board Standoff
  • For Use With:Receptacle Assembly

Packaging Features

  • Packaging Method:Tube
  • Packaging Quantity:18

Accessories

Accessories

No details available.