536272-4 TE Connectivity
536272-4 - TE Connectivity
TE Connectivity
536272-4
0-0536272-4
Other Connectors
Micro-Strip Stiftstecker
100pol
    

Technical Characteristics

Technical Characteristics

Product Type Features

  • Connector Assembly Type:PCB Mount Header
  • Connector System:Board-to-Board
  • Row-to-Row Spacing:2.54mm[.1in]
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board
  • Connector Type:Connector Assembly
  • Boss:No
  • Product Type:Connector

Configuration Features

  • Stackable:Yes
  • PCB Mount Orientation:Vertical
  • Number of Positions:100
  • Board-to-Board Configuration:Vertical
  • Number of Rows:2

Electrical Characteristics

  • Insulation Resistance(VAC):100
  • Voltage(VAC):30
  • Insulation Resistance(MO):2

Body Features

  • Busbar Mating Area Plating Thickness:30
  • Cover Material:Phosphor Bronze
  • Busbar Termination Area Plating Material:Tin-Lead with Nickel underplated
  • Busbar Material:Phosphor Bronze
  • Busbar Mating Area Plating Material:Gold

Contact Features

  • Contact Base Material:Phosphor Bronze
  • PCB Contact Termination Area Plating Material:Tin-Lead
  • Contact Mating Area Plating Material:Gold
  • Contact Mating Area Plating Thickness:.76µm[30µin]
  • Contact Type:Pin
  • Contact Current Rating (Max)(A):10.5
  • PCB Contact Termination Area Plating Thickness(µin):100 – 300

Termination Features

  • Termination Method to Printed Circuit Board:Through Hole - Solder

Mechanical Attachment

  • Mating Alignment:With
  • Mating Alignment Type:Polarization
  • PCB Mount Retention:Without
  • PCB Mount Alignment:With
  • Connector Mounting Type:Board Mount
  • PCB Mount Alignment Type:Locating Posts

Housing Features

  • Centerline (Pitch):1.27mm[.05in]
  • Housing Material:High Temperature Thermoplastic

Dimensions

  • Stack Height(mm):10.92, 31.12
  • Stack Height(in):1.225
  • PCB Thickness (Recommended)(in):.76
  • Height:8.64mm[.34in]
  • Tail Length(in):.125

Usage Conditions

  • Operating Temperature Range:-65 – 125°C[-85 – 257°F]
  • Flame Retardant:Yes

Operation/Application

  • Pick and Place Cover:Without
  • Circuit Application:Signal
  • Solder Process Feature:Board Standoff
  • For Use With:Receptacle Assembly

Packaging Features

  • Packaging Method:Tube
  • Packaging Quantity:8

Accessories

Accessories

No details available.