5223004-8 TE Connectivity
5223004-8 - TE Connectivity
TE Connectivity
5223004-8
0-5223004-8
PCB-Connectors
Z-PACK 2mm FB (Future Bus +)
    

Technical Characteristics

Technical Characteristics

Product Type Features

  • PCB Connector Assembly Type:PCB Mount Receptacle
  • Connector System:Board-to-Board
  • Row-to-Row Spacing:2mm[.079in]
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board
  • Series:Signal
  • Boss:No
  • Stabilizers:Solder Post
  • Product Type:Connector

Configuration Features

  • Number of Signal Positions:240
  • Stackable:No
  • PCB Mount Orientation:Right Angle
  • Number of Positions:240
  • Board-to-Board Configuration:Right Angle
  • Sequencing:No
  • Number of Rows:5

Electrical Characteristics

  • Impedance(O):240
  • Dielectric Withstanding Voltage(VAC):1000
  • Voltage(VAC):30
  • Insulation Resistance(MO):5

Body Features

  • Busbar Mating Area Plating Thickness:1000

Contact Features

  • Contact Base Material:Phosphor Bronze
  • PCB Contact Termination Area Plating Material:Tin
  • Contact Configuration:Dual Beam
  • Contact Mating Area Plating Material:Gold
  • Contact Mating Area Plating Thickness:.05µm[1.9685µin]
  • Contact Type:Socket
  • Contact Current Rating (Max)(A):3
  • PCB Contact Termination Area Plating Thickness:3.81µm[149.9997µin]
  • Contact Mating Area Plating Material Finish:Matte
  • Contact Layout:Matrix

Termination Features

  • Termination Method to Printed Circuit Board:Through Hole - Solder
  • Termination Post Length:2.73mm[.107in]

Mechanical Attachment

  • PCB Mount Retention Type:Hold-Down Post
  • Mating Alignment:With
  • Mating Alignment Type:Polarization
  • PCB Mount Retention:Without
  • PCB Mount Alignment:With
  • Connector Mounting Type:Board Mount
  • PCB Mount Alignment Type:Locating Posts

Housing Features

  • Centerline (Pitch):2mm[.079in]
  • Housing Material:LCP (Liquid Crystal Polymer)

Dimensions

  • PCB Thickness (Recommended)(in):.05
  • Height:13.3mm[.52269in]
  • Tail Length:.05mm[.107289in]

Usage Conditions

  • Operating Temperature Range:-55 – 125°C[-67 – 257°F]

Operation/Application

  • Pick and Place Cover:Without
  • Circuit Application:Signal
  • Solder Process Feature:Board Standoff

Packaging Features

  • Packaging Method:Tube
  • Packaging Quantity:6

Accessories

Accessories

No details available.