5223002-4 TE Connectivity
5223002-4 - TE Connectivity
TE Connectivity
5223002-4
0-5223002-4
PCB-Connectors
Z-PACK 2mm FB (Future Bus +)
    

Technical Characteristics

Technical Characteristics

Product Type Features

  • PCB Connector Assembly Type:PCB Mount Header
  • Connector System:Board-to-Board
  • Header Type:Shrouded
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board
  • Series:Signal
  • Boss:No
  • Stabilizers:Press-Fit
  • Product Type:Connector

Configuration Features

  • Number of Signal Positions:120
  • Stackable:No
  • PCB Mount Orientation:Vertical
  • Number of Positions:120
  • Board-to-Board Configuration:Vertical
  • Sequencing:No
  • Number of Rows:5

Electrical Characteristics

  • Impedance(O):120
  • Dielectric Withstanding Voltage(VAC):1000
  • Voltage(VAC):30
  • Insulation Resistance(MO):5

Body Features

  • Busbar Mating Area Plating Thickness:1000

Contact Features

  • Contact Base Material:Phosphor Bronze
  • PCB Contact Termination Area Plating Material:Tin
  • Contact Mating Area Plating Material:Gold
  • Contact Mating Area Plating Thickness(µin):29.9212
  • Contact Type:Pin
  • Contact Current Rating (Max)(A):3
  • PCB Contact Termination Area Plating Thickness:.6µm[23.622µin]
  • Contact Layout:Matrix

Termination Features

  • Termination Method to Printed Circuit Board:Through Hole - Press-Fit
  • Termination Post Length:4.25mm[.167in]

Mechanical Attachment

  • PCB Mount Retention Type:Action/Compliant Tail
  • Mating Alignment:With
  • Mating Alignment Type:Polarization
  • PCB Mount Retention:With
  • PCB Mount Alignment:Without
  • Connector Mounting Type:Board Mount

Housing Features

  • Centerline (Pitch):2mm[.079in]
  • Housing Color:Natural
  • Housing Material:LCP (Liquid Crystal Polymer)

Dimensions

  • Width:18mm[.709in]
  • Mating Post Length:6.5mm[.256in]
  • Height:17.8mm[.7in]
  • Tail Length(in):.167

Usage Conditions

  • Operating Temperature Range:-55 – 125°C[-67 – 257°F]

Operation/Application

  • Pick and Place Cover:Without
  • Circuit Application:Signal
  • Solder Process Feature:Board Standoff

Packaging Features

  • Packaging Method:Tube
  • Packaging Quantity:12

Other

  • Comment:Sequencing of the mating posts and lead lengths is available. Worksheets for this procedure may be found under Z-PACK 2mm FB General Information.

Accessories

Accessories

No details available.