5177827-1 TE Connectivity
5177827-1 - TE Connectivity
TE Connectivity
5177827-1
0-5177827-1
Other Connectors
Memory Sockets
    

Datasheets

Datasheets

Technical Characteristics

Technical Characteristics

Product Type Features

  • DRAM Type:Standard
  • Row-to-Row Spacing:5.2mm[.2in]
  • Connector & Contact Terminates To:Printed Circuit Board
  • Profile:Standard
  • Product Type:Socket

Configuration Features

  • Number of Positions:72
  • Module Orientation:Right Angle
  • Number of Rows:2
  • Keying:Short
  • Number of Keys:1
  • Center Key:None

Electrical Characteristics

  • DRAM Voltage(V):3.3

Body Features

  • Ejector Type:Locking
  • Retention Post Location:None
  • Latch Plating Material:Tin
  • Latch Material:Copper Alloy
  • Ejector Location:Both Ends
  • Ejector Material:Copper Alloy

Contact Features

  • Contact Base Material:Copper Alloy
  • PCB Contact Termination Area Plating Material:Tin
  • Contact Underplating Material:Nickel
  • Socket Type:Memory Card
  • Socket Style:M3 (Mini Memory Module)
  • Contact Mating Area Plating Thickness:.76µm[30µin]
  • Solder Tail Contact Plating Thickness:2µm[78.7µin]
  • Contact Mating Area Plating Material:Gold

Termination Features

  • Insertion Style:Cam-In

Mechanical Attachment

  • PCB Mount Retention Type:Solder Tail (Pin)
  • PCB Mount Retention:Without
  • Locating Posts:Without
  • PCB Mounting Style:Surface Mount
  • Polarization:Left
  • Mounting Angle:Right Angle

Housing Features

  • Centerline (Pitch):1.27mm[.05in]
  • Housing Color:Natural
  • Housing Material:LCP (Liquid Crystal Polymer)

Dimensions

  • Height Above PC Board:5.5mm[.21in]

Industry Standards

  • UL Flammability Rating:UL 94V-0

Packaging Features

  • Packaging Method:Box & Tray, Tray
  • Packaging Quantity:35

Accessories

Accessories

No details available.