50935-6 TE Connectivity
50935-6 - TE Connectivity
TE Connectivity
50935-6
0-0050935-6
Other Connectors
Mini-Spring Sockets
    

Technical Characteristics

Technical Characteristics

Product Type Features

  • Sleeve Style:Open Bottom
  • Connector System:Cable-to-Board
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board
  • Product Type:Contact
  • Profile:Zero
  • Wire/Cable Type:Discrete Wire

Body Features

  • Sealant:No
  • Sleeve Plating Material:Gold Flash over Nickel
  • Sleeve Material:Copper

Contact Features

  • Contact Base Material:Beryllium Copper
  • Contact Current Rating (Max)(A):5
  • Contact Type:Socket
  • Contact Spring Plating Thickness:.762µm[30µin]
  • Contact Spring Plating Material:Gold
  • Contact Mating Area Plating Thickness:30µm[30µin]
  • Contact Transmits (Typical):Signal (Data)/Power
  • Socket Type:Discrete

Termination Features

  • Termination Method to Printed Circuit Board:Through Hole - Press-Fit
  • Termination Method to Wire & Cable:Solder
  • Insertion Method:Hand/Semi-Automatic

Dimensions

  • Socket Length:4.27mm[.168in]
  • Hole Size (Recommended):1.04mm[.041in]
  • Wire/Cable Size:.081 – .162mm²[28 – 25AWG]
  • Mating Pin Diameter Range:.33 – .51mm[.013 – .02in]
  • PCB Thickness (Recommended):.79 – 3.18mm[.031 – .125in]

Usage Conditions

  • Operating Temperature Range:-65 – 125°C[-85 – 257°F]

Operation/Application

  • Circuit Application:Power & Signal

Packaging Features

  • Packaging Method:Bag, Loose Piece
  • Packaging Quantity:1000

Other

  • Spring Material:Beryllium Copper

Accessories

Accessories

No details available.