2013266-1 TE Connectivity
2013266-1 - TE Connectivity
TE Connectivity
2013266-1
0-2013266-1
Other Connectors
Memory Sockets
    

Technical Characteristics

Technical Characteristics

Product Type Features

  • DRAM Type:Double Data Rate (DDR) 3
  • Row-to-Row Spacing:1.9mm[.075in]
  • Connector & Contact Terminates To:Printed Circuit Board
  • Center Post:Without
  • Product Type:Socket

Configuration Features

  • Number of Positions:240
  • Module Orientation:Vertical
  • Number of Bays:2
  • Number of Rows:2
  • Keying:Standard
  • Number of Keys:1
  • Center Key:Offset Left

Electrical Characteristics

  • DRAM Voltage(V):1.5

Body Features

  • Ejector Type:Standard
  • Retention Post Location:Both Ends
  • Latch Color:Natural
  • Module Key Type:Offset Left
  • Latch Material:High Temperature Thermoplastic
  • Ejector Location:Both Ends
  • Ejector Material:High Temperature Thermoplastic
  • Ejector Material Color:Natural

Contact Features

  • Contact Base Material:Copper Alloy
  • PCB Contact Termination Area Plating Material:Matte Tin
  • Contact Underplating Material:Nickel
  • Socket Type:Memory Card
  • Socket Style:DIMM
  • Solder Tail Contact Plating Thickness:2.54µm[100µin]
  • Contact Mating Area Plating Thickness:.38µm[15µin]
  • Contact Mating Area Plating Material:Gold

Termination Features

  • Insertion Style:Direct Insert
  • Termination Post Length:3.38mm[.133in]

Mechanical Attachment

  • PCB Mount Retention Type:Solder Tail (Pin)
  • PCB Mount Retention:With
  • Locating Posts:With
  • PCB Mounting Style:Through Hole
  • Polarization:Left
  • Mounting Angle:Vertical

Housing Features

  • Centerline (Pitch):1mm[.039in]
  • Housing Color:Black
  • Housing Material:High Temperature Nylon

Dimensions

  • Height Above PC Board:23.1mm[.9in]
  • Center Retention Hole Diameter:1.8mm[.07in]

Industry Standards

  • UL Flammability Rating:UL 94V-0

Packaging Features

  • Packaging Method:Box & Tray, Tray
  • Packaging Quantity:64

Other

  • Comment:With LED Position.

Accessories

Accessories

No details available.