2-2013311-2 TE Connectivity
2-2013311-2 - TE Connectivity
TE Connectivity
2-2013311-2
2-2013311-2
Other Connectors
Memory Sockets
    

Technical Characteristics

Technical Characteristics

Product Type Features

  • DRAM Type:Double Data Rate (DDR) 3
  • Connector System:Cable-to-Board
  • Profile:Reverse
  • Row-to-Row Spacing:8.2mm[.322in]
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board
  • Product Type:Socket

Configuration Features

  • Module Orientation:Right Angle
  • Number of Positions:204
  • Number of Rows:2
  • Keying:Reverse
  • Number of Keys:1
  • Center Key:Offset Right
  • Number of Bays:2

Electrical Characteristics

  • DRAM Voltage(V):1.5

Signal Characteristics

  • SGRAM Voltage(V):1.5

Body Features

  • Ejector Type:Locking
  • Module Key Type:SGRAM
  • Latch Plating Material:Tin
  • Latch Material:Stainless Steel
  • Ejector Location:Both Ends

Contact Features

  • Contact Base Material:Copper Alloy
  • PCB Contact Termination Area Plating Material:Gold
  • Contact Mating Area Plating Material:Gold
  • Contact Mating Area Plating Thickness:.254µm[10µin]
  • Contact Current Rating (Max)(A):.5
  • Socket Type:Memory Card
  • Socket Style:SO DIMM

Termination Features

  • Insertion Style:Cam-In

Mechanical Attachment

  • PCB Mount Retention Type:Solder Peg
  • PCB Mount Retention:With
  • PCB Mounting Style:Surface Mount
  • Connector Mounting Type:Board Mount

Housing Features

  • Centerline (Pitch):.6mm[.024in]
  • Housing Material:High Temperature Thermoplastic
  • Housing Color:Black

Dimensions

  • Stack Height:9.2mm[.362in]

Usage Conditions

  • Operating Temperature Range:-55 – 85°C[-67 – 185°F]

Operation/Application

  • Circuit Application:Power

Industry Standards

  • UL Flammability Rating:UL 94V-0

Packaging Features

  • Packaging Method:Emboss on Reel
  • Packaging Quantity:150

Other

  • Comment:With floating peg.

Accessories

Accessories

No details available.