536273-5 - TE Connectivity
TE Connectivity
536273-5
0-0536273-5
0-0536273-5
Other Connectors
AMP Micro-Strip Products
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- Connector Assembly Type:PCB Mount Header
- Connector System:Board-to-Board
- Row-to-Row Spacing:2.54mm[.1in]
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
- Connector Type:Connector Assembly
- Boss:No
- Product Type:Connector
Configuration Features
- Stackable:Yes
- PCB Mount Orientation:Vertical
- Number of Positions:120
- Board-to-Board Configuration:Vertical
- Number of Rows:2
Electrical Characteristics
- Insulation Resistance(VAC):120
- Voltage(VAC):30
- Insulation Resistance(MO):2
Body Features
- Busbar Mating Area Plating Thickness:30
- Cover Material:Phosphor Bronze
- Busbar Termination Area Plating Material:Tin-Lead with Nickel underplated
- Busbar Material:Phosphor Bronze
- Busbar Mating Area Plating Material:Gold
Contact Features
- Contact Base Material:Phosphor Bronze
- PCB Contact Termination Area Plating Material:Tin-Lead
- Contact Mating Area Plating Material:Gold
- Contact Mating Area Plating Thickness:.76µm[30µin]
- Contact Type:Pin
- Contact Current Rating (Max)(A):10.5
- PCB Contact Termination Area Plating Thickness(µin):100 – 300
Termination Features
- Termination Method to Printed Circuit Board:Through Hole - Solder
Mechanical Attachment
- Mating Alignment:With
- Mating Alignment Type:Polarization
- PCB Mount Retention:Without
- PCB Mount Alignment:With
- Connector Mounting Type:Board Mount
- PCB Mount Alignment Type:Locating Posts
Housing Features
- Centerline (Pitch):1.27mm[.05in]
- Housing Material:High Temperature Thermoplastic
Dimensions
- Stack Height(mm):10.92, 31.12
- Stack Height(in):1.225
- PCB Thickness (Recommended)(in):.76
- Height:8.64mm[.34in]
- Tail Length(in):.185
Usage Conditions
- Operating Temperature Range:-65 – 125°C[-85 – 257°F]
- Flame Retardant:Yes
Operation/Application
- Pick and Place Cover:Without
- Circuit Application:Signal
- Solder Process Feature:Board Standoff
- For Use With:Receptacle Assembly
Packaging Features
- Packaging Method:Tube
- Packaging Quantity:7
Accessories
Accessories
No details available.
