
5223004-2 - TE Connectivity
TE Connectivity
5223004-2
0-5223004-2
0-5223004-2
PCB-Connectors
Z-PACK 2mm FB (Future Bus +)
 
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- PCB Connector Assembly Type:PCB Mount Receptacle
 - Connector System:Board-to-Board
 - Sealable:No
 - Connector & Contact Terminates To:Printed Circuit Board
 - Series:Signal
 - Boss:No
 - Stabilizers:Solder Post
 - Product Type:Connector
 
Configuration Features
- Number of Signal Positions:60
 - Stackable:No
 - PCB Mount Orientation:Right Angle
 - Number of Positions:60
 - Board-to-Board Configuration:Right Angle
 - Sequencing:No
 - Number of Rows:5
 
Electrical Characteristics
- Impedance(O):60
 - Dielectric Withstanding Voltage(VAC):1000
 - Voltage(VAC):30
 - Insulation Resistance(MO):5
 
Body Features
- Busbar Mating Area Plating Thickness:1000
 
Contact Features
- Contact Base Material:Phosphor Bronze
 - PCB Contact Termination Area Plating Material:Tin
 - Contact Configuration:Dual Beam
 - Contact Mating Area Plating Material:Gold
 - Contact Mating Area Plating Thickness(µin):1.9685
 - Contact Type:Socket
 - Contact Current Rating (Max)(A):3
 - PCB Contact Termination Area Plating Thickness:3.81µm[149.9997µin]
 - Contact Mating Area Plating Material Finish:Matte
 - Contact Layout:Matrix
 
Termination Features
- Termination Method to Printed Circuit Board:Through Hole - Solder
 - Termination Post Length:2.73mm[.107in]
 
Mechanical Attachment
- PCB Mount Retention Type:Hold-Down Post
 - Mating Alignment:With
 - Mating Alignment Type:Polarization
 - PCB Mount Retention:Without
 - PCB Mount Alignment:With
 - Connector Mounting Type:Board Mount
 - PCB Mount Alignment Type:Locating Posts
 
Housing Features
- Centerline (Pitch):2mm[.079in]
 - Housing Color:Natural
 - Housing Material:LCP (Liquid Crystal Polymer)
 
Dimensions
- Height:13.3mm[.52269in]
 - Tail Length:.05mm[.107289in]
 
Usage Conditions
- Operating Temperature Range:-55 – 125°C[-67 – 257°F]
 
Operation/Application
- Pick and Place Cover:Without
 - Circuit Application:Signal
 - Solder Process Feature:Board Standoff
 
Packaging Features
- Packaging Method:Tube
 - Packaging Quantity:24
 
Accessories
Accessories
No details available.
		            



