146769-1 - TE Connectivity
TE Connectivity
146769-1
0-0146769-1
0-0146769-1
PCB-Connectors
AMPMODU Mod II H
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- Connector Assembly Type:PCB Mount Receptacle
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
- Series:AMPMODU, MOD II
- Connector Type:Connector Assembly
- Profile:Standard
- Boss:No
- Product Type:Connector
Configuration Features
- Stackable:Yes
- PCB Mount Orientation:Right Angle
- Number of Positions:15
- Number of Rows:1
Contact Features
- Contact Base Material:Phosphor Bronze
- PCB Contact Termination Area Plating Material:Tin-Lead
- Contact Configuration:Short Point
- Solder Tail Contact Plating Material Finish:Bright
- Contact Mating Area Plating Material:Gold
- Contact Mating Area Plating Thickness(µin):30
- Contact Type:Socket
- Contact Current Rating (Max)(A):2
- PCB Contact Termination Area Plating Thickness(µin):150 – 300
- Contact Layout:Inline
Termination Features
- Termination Method to Printed Circuit Board:Through Hole
- Termination Post Length:2.92mm[.115in]
Mechanical Attachment
- PCB Mount Retention:Without
Housing Features
- Centerline (Pitch):2.54mm[.1in]
- Housing Color:Black
- Housing Material:Polyester - GF
- Housing Entry Style:Closed Entry
Dimensions
- Height:3.48mm[.137in]
- Tail Length:2.921mm[.115in]
Usage Conditions
- Operating Temperature Range(°C):-55 – 125
- High Temperature Compatible:No
Operation/Application
- Pick and Place Cover:Without
- Solder Process Feature:Board Standoff
- For Use With:Mates with Headers
Industry Standards
- UL Flammability Rating:UL 94V-1
- MIL-C-55032:No
Packaging Features
- Packaging Method:Tube
- Packaging Quantity:15
Other
- Comment:Positions 2-7 & 9-14 are omitted TE recommends mating gold or duplex plated headers with duplex plated receptacle assemblies.
Accessories
Accessories
No details available.
