1367073-2 - TE Connectivity
TE Connectivity
1367073-2
0-1367073-2
0-1367073-2
Other Connectors
SFP Steckverbinder
20pol., Bandw.
20pol., Bandw.
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- Form Factor:SFP
- Product Type:Connector
- Included Heat Sink:No
- Connector System:Cable-to-Board
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
Configuration Features
- Number of Positions:20
Electrical Characteristics
- Data Rate (Max)(Gb/s):4
Contact Features
- Contact Current Rating (Max)(A):.5
- Contact Mating Area Plating Material:Gold
- Contact Mating Area Plating Thickness:.76µm[29.92µin]
Termination Features
- Termination Method to Printed Circuit Board:Surface Mount
Mechanical Attachment
- PCB Mounting Style:Surface Mount
- Connector Mounting Type:Board Mount
Housing Features
- Centerline (Pitch):.8mm[.031in]
Usage Conditions
- Operating Temperature Range:-55 – 85°C[-67 – 185°F]
Operation/Application
- For Use With Pluggable I/O Products:SFP Cage
- Pluggable I/O Applications:SFP
- Circuit Application:Power & Signal
Industry Standards
- UL Flammability Rating:UL 94V-0
Packaging Features
- Packaging Method:Reel
Accessories
Accessories
No details available.
